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MediaTek has announced that it will launch its highly anticipated Dimensity 9300+ chipset at the MediaTek Dimensity Developer Conference (MDDC) 2024 on May 7 in China. The conference, themed "AI for Everything," is expected to showcase the company's AI strategy, vision, and the latest advancements in the generative AI application ecosystem and gaming experience . The Dimensity 9300+ is set to succeed the Dimensity 9300, offering enhanced performance and advanced AI capabilities . According to earlier reports, the SoC will feature an ARM Cortex-X4 prime core clocked at 3.4GHz, a slight increase from the 3.25GHz clock speed of its predecessor. Additionally, the chipset will include three ARM Cortex-X4 performance cores running at 2.85GHz and four Cortex-A720 efficiency cores clocked at 2.0GHz. Geekbench leaks have revealed impressive scores for the Dimensity 9300+, with a single-core score of 2229 and a multi-core score of 7526. These results suggest that the new chipset will deliver a significant performance boost compared to its predecessor. vivo X100S smartphone , set to launch in China in May, will be one of the first devices to be powered by the Dimensity 9300+. The phone is rumored to feature a 6.78-inch 1.5K 8T LTPO OLED straight screen, a flat metal frame, a glass back, and support for 120W fast charging.
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